Title:
MEMS AUDIO SENSOR
Document Type and Number:
WIPO Patent Application WO/2019/035534
Kind Code:
A1
Abstract:
A MEMS audio device can comprise: a substrate; a diaphragm supported on the substrate and modified by a sound wave provided from the outside; and a fixed plate including a plurality of through holes, and arranged to face the diaphragm so as to provide a variable capacitance together with the modified diaphragm, wherein the diaphragm comprises a cut line formed at equal intervals along the circumferential direction, the cut line comprises: an inner cut line formed around the center of the diaphragm at equal intervals along the circumferential direction at an inner side; and an outer cut line formed around the center of the diaphragm at equal intervals along the circumferential direction at an outer side, and the inner cut line comprises: a circumferential direction cut part formed along the circumferential direction; and a radius direction cut part radially extending from both ends of the circumferential direction cut part toward the center of the diaphragm.
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Inventors:
SONG CI MOO (KR)
LEE SANG WOO (US)
AHN JAE HYUN (KR)
KIM YONG KOOK (KR)
LEE SANG WOO (US)
AHN JAE HYUN (KR)
KIM YONG KOOK (KR)
Application Number:
PCT/KR2018/005377
Publication Date:
February 21, 2019
Filing Date:
May 10, 2018
Export Citation:
Assignee:
SHIN SUNG C&T CO LTD (KR)
International Classes:
H04R19/00; B81C1/00; H04R19/04
Foreign References:
| KR20080015109A | 2008-02-18 | |||
| KR20110125589A | 2011-11-21 | |||
| US20130244365A1 | 2013-09-19 | |||
| KR20130044487A | 2013-05-03 | |||
| JP2013124947A | 2013-06-24 |
Attorney, Agent or Firm:
KASAN IP & LAW FIRM (KR)
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