Title:
MEMS DEVICE ASSEMBLY ENCAPSULATED BY FILM HAVING ARC-SHAPED STRUCTURE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/181976
Kind Code:
A1
Abstract:
An MEMS device assembly comprises: an MEMS device having a surface to be encapsulated; and an encapsulation film (14) used to form an encapsulation space (17) for encapsulation of the MEMS device, wherein the encapsulation film (14) has a top portion, an edge portion and a connection portion positioned between the top portion and the edge portion, the edge portion, the connection portion and the top portion define the encapsulation space (17), the edge portion is provided at the surface to be encapsulated, and the connection portion is arc-shaped. An included angle (α) formed between the encapsulation film (14) and the surface to be encapsulated can be within a range from 2 to 45 degrees. The encapsulation space (17) can be an arc-shaped space. The MEMS device can be a film bulk acoustic resonator. Also provided is an electronic apparatus having the above MEMS device assembly.
Inventors:
ZHANG MENGLUN (CN)
PANG WEI (CN)
YANG QINGRUI (CN)
PANG WEI (CN)
YANG QINGRUI (CN)
Application Number:
PCT/CN2020/076212
Publication Date:
September 17, 2020
Filing Date:
February 21, 2020
Export Citation:
Assignee:
UNIV TIANJIN (CN)
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
International Classes:
H03H3/02; H03H9/02; H03H9/10; H03H9/17
Foreign References:
| US20110121414A1 | 2011-05-26 | |||
| US20110121414A1 | 2011-05-26 | |||
| CN102449906A | 2012-05-09 | |||
| CN1373556A | 2002-10-09 | |||
| CN107196618A | 2017-09-22 | |||
| CN108667437A | 2018-10-16 | |||
| US20110090651A1 | 2011-04-21 |
Attorney, Agent or Firm:
BEIJING JINCHENG TONGDA & NEAL LAW FIRM (CN)
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