Title:
MEMS DEVICE FOR EUV MASK-LESS LITHOGRAPHY
Document Type and Number:
WIPO Patent Application WO/2023/184517
Kind Code:
A1
Abstract:
A MEMS device (100) configured to implement mirror structures (108) for mask-less EUV lithography is disclosed. The mirror structures (108) are arranged above a CMOS substrate (101). A dielectric layer (102) is arranged on the CMOS substrate (101) and comprises four bias pads (103) and a drive electrode (104) extending from the CMOS substrate (101) through the dielectric layer (102). Four support structures (105) are arranged on the dielectric layer (102) and extend from the bias pads (103). Further, a MEMS layer comprising a suspended membrane (106) and four mounting elements (107) is attached to the support structures (105), wherein a part of each mounting element (107) is sandwiched by one of the support structures (105). The mirror structures (108) are provided on a top and/or bottom surface of the membrane (106). The CMOS substrate (101) is configured to actuate the MEMS layer to move the suspended membrane (106) by controlling the drive electrode (104) and by biasing the MEMS layer via the bias pads (103) and support structures (105).
Inventors:
MULLER PHILIPPE (DE)
CHEN YIJIAN (CN)
CHEN YIJIAN (CN)
Application Number:
PCT/CN2022/084944
Publication Date:
October 05, 2023
Filing Date:
April 02, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G02B26/08; B81B3/00; B81B7/02; B81C1/00
Foreign References:
| CN113942973A | 2022-01-18 | |||
| US20020117728A1 | 2002-08-29 | |||
| CN103547955A | 2014-01-29 | |||
| CN113003533A | 2021-06-22 | |||
| CN112946877A | 2021-06-11 |
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