Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MEMS DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/047663
Kind Code:
A1
Abstract:
The present invention makes it possible to prevent metal from protruding out from a bonding surface of eutectic bonding. The present invention is provided with a lower substrate having an element having a wiring on a surface, an upper substrate provided so as to face the element, and a bonding section bonding the lower substrate and the upper substrate in the periphery of the element. The bonding section has a first region, a second region, and a third region that are provided consecutively spanning from a portion close to the element to a portion far therefrom. The first region and/or the third region contains a hypereutectic alloy of a first component or a second component, which has a higher melting point than the other component. The second region contains a eutectic alloy of the first component and the second component.

Inventors:
FUKUMITSU MASAKAZU (JP)
YAMADA SHUHEI (JP)
Application Number:
PCT/JP2016/077174
Publication Date:
March 23, 2017
Filing Date:
September 14, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B81B7/02; B23K20/00; B81C3/00; H01L23/02; H03H9/02
Domestic Patent References:
WO2010032821A12010-03-25
WO2011070627A12011-06-16
WO2011111540A12011-09-15
Foreign References:
JP2013228256A2013-11-07
JP2013052449A2013-03-21
JP2013039660A2013-02-28
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF: