Title:
MEMS LOUDSPEAKER ARRAY
Document Type and Number:
WIPO Patent Application WO/2024/051441
Kind Code:
A1
Abstract:
A MEMS loudspeaker array (100), which relates to the field of MEMS loudspeakers, and is used for solving the technical problem that the sound production efficiency and the working bandwidth of MEMS loudspeakers cannot be simultaneously met. The MEMS loudspeaker array (100) comprises a substrate (23) and a diaphragm unit array provided on the substrate (23), the diaphragm unit array comprising at least two diaphragm units (10) arranged in a spaced manner, and the at least two diaphragm units (10) having at least two different resonance frequencies. The present invention can increase the sound production efficiency of the MEMS loudspeaker array (100) while meeting the working bandwidth of the MEMS loudspeaker array (100).
Inventors:
ZHANG MENGLUN (CN)
SUN MINGCHAO (CN)
PANG WEI (CN)
SUN MINGCHAO (CN)
PANG WEI (CN)
Application Number:
PCT/CN2023/112681
Publication Date:
March 14, 2024
Filing Date:
August 11, 2023
Export Citation:
Assignee:
UNIV TIANJIN (CN)
International Classes:
H04R19/00
Domestic Patent References:
| WO2022180161A1 | 2022-09-01 |
Foreign References:
| CN114501268A | 2022-05-13 | |||
| CN216217515U | 2022-04-05 | |||
| CN211240071U | 2020-08-11 | |||
| CN215268715U | 2021-12-21 | |||
| US20170048623A1 | 2017-02-16 | |||
| CN113993050A | 2022-01-28 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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