Title:
MEMS MICROPHONE, ARRAY STRUCTURE, AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/119873
Kind Code:
A1
Abstract:
The present invention provides a MEMS microphone, comprising a substrate having a rear cavity, and a piezoelectric diaphragm fixed on said substrate; the piezoelectric diaphragm comprises a main diaphragm fixed on the base and a piezoelectric thin film fixed on said main diaphragm; the main diaphragm comprises a border frame part fixedly connected to the substrate, a main body part arranged at intervals inside the border frame part and corresponding to the rear cavity, and a support beam connecting the main body part and the frame part; the piezoelectric thin film is disposed on the main body part. Thus the central area of the piezoelectric zone has a larger amount of deformation than existing diaphragm structures; however, because of the restraint of the supporting beam, the amount of deformation is also caused to be much smaller than that of existing cantilever beam structures, and the microphone has a higher sensitivity while excessive piezoelectric deformation is avoided.
Inventors:
TONG BEI (CN)
LI YANG (CN)
LAI KAH KEEN (SG)
ZHONG XIAOHUI (CN)
DUAN LIAN (CN)
ZHANG RUI (CN)
LI YANG (CN)
LAI KAH KEEN (SG)
ZHONG XIAOHUI (CN)
DUAN LIAN (CN)
ZHANG RUI (CN)
Application Number:
PCT/CN2019/125458
Publication Date:
June 24, 2021
Filing Date:
December 15, 2019
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECHNOLOGIES PTE LTD (SG)
AAC TECHNOLOGIES PTE LTD (SG)
International Classes:
H04R19/04
Foreign References:
| CN102264020A | 2011-11-30 | |||
| US20120098076A1 | 2012-04-26 | |||
| US20170171667A1 | 2017-06-15 | |||
| CN110574396A | 2019-12-13 | |||
| CN109640233A | 2019-04-16 | |||
| CN110099345A | 2019-08-06 |
Attorney, Agent or Firm:
SHENZHEN HUASHENG ZHIHUI INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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