Title:
MEMS MICROPHONE CHIP TRIMMING METHOD, APPARATUS, MANUFACTURING METHOD AND MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2017/075766
Kind Code:
A1
Abstract:
The present invention discloses a MEMS microphone chip trimming method, apparatus, manufacturing method and microphone. The method for trimming MEMS microphone chips comprises: detecting a pull-in voltage distribution of MEMS microphone chips on a wafer; providing a mask based on the pull-in voltage distribution; and trimming the MEMS microphone chips on the wafer by using the mask.
Inventors:
ZOU QUANBO (CN)
WANG ZHE (CN)
LOKE YAN (CN)
WANG ZHE (CN)
LOKE YAN (CN)
Application Number:
PCT/CN2015/093733
Publication Date:
May 11, 2017
Filing Date:
November 03, 2015
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H04R29/00
Foreign References:
US20130136267A1 | 2013-05-30 | |||
US20130154054A1 | 2013-06-20 | |||
US20100277229A1 | 2010-11-04 | |||
US20020088109A1 | 2002-07-11 | |||
EP1764343A2 | 2007-03-21 | |||
US20110013787A1 | 2011-01-20 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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