Title:
MEMS MICROPHONE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/002540
Kind Code:
A1
Abstract:
The present invention relates to a microphone and, more particularly, to a MEMS microphone. A microphone according to an example of the present invention comprises: a case including a side wall and an upper wall, and having an open lower side; a substrate coupled to the lower side of the case; a MEMS transducer positioned on the substrate and converting sound waves input from the outside into an electrical signal; and a signal processing unit provided on the substrate and amplifying and outputting the electrical signal input from the MEMS transducer, wherein the case is fixed to the substrate by an adhesive layer, and the adhesive layer is positioned between the substrate and the case and includes a metal layer containing tin (Sn) and an insulating layer covering the surface of the metal layer and containing an epoxy-based material.
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Inventors:
YUN SANG YOUNG (KR)
MIN CHOL KYU (KR)
MIN CHOL KYU (KR)
Application Number:
PCT/KR2019/014472
Publication Date:
January 07, 2021
Filing Date:
October 30, 2019
Export Citation:
Assignee:
PARTRON CO LTD (KR)
International Classes:
H04R19/04; H04R19/00; H04R19/01
Foreign References:
| KR100650280B1 | 2006-11-29 | |||
| JP2015012605A | 2015-01-19 | |||
| KR100737730B1 | 2007-07-10 | |||
| KR20170126768A | 2017-11-20 | |||
| KR101244047B1 | 2013-03-15 |
Attorney, Agent or Firm:
E-BIRD INTERNATIONAL IP LAW FIRM (KR)
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