Title:
MEMS MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2019/221116
Kind Code:
A1
Abstract:
This MEMS microphone comprises: a glass substrate (11) having an opening (11A); a membrane (13) provided on the glass substrate (11) to cover the opening (11A) and comprising a first conductive layer (13B); and a back plate (16) provided above the membrane (13) via a cavity (15), having a plurality of through-holes (18) through which sound waves pass, and comprising a second conductive layer (16A). The first conductive layer (13B) is formed of a metal or a conductive oxide. The second conductive layer (16A) is formed of a metal or a conductive oxide.
Inventors:
GOTOH YASUKO (JP)
CHIKAMORI HIROYUKI (JP)
NOMURA NAOHIRO (JP)
INAGAKI NAOKI (JP)
CHIKAMORI HIROYUKI (JP)
NOMURA NAOHIRO (JP)
INAGAKI NAOKI (JP)
Application Number:
PCT/JP2019/019108
Publication Date:
November 21, 2019
Filing Date:
May 14, 2019
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H04R19/04; B81B3/00
Foreign References:
| US20160088402A1 | 2016-03-24 | |||
| US20090278217A1 | 2009-11-12 | |||
| US20120299130A1 | 2012-11-29 | |||
| US20100244162A1 | 2010-09-30 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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