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Title:
MEMS MULTI-MODULE ASSEMBLY, MANUFACTURING METHOD AND ELECTRONICS APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/075764
Kind Code:
A1
Abstract:
A MEMS multi-module assembly, a manufacturing method and an electronics apparatus are provided. The MEMS multi-module assembly comprises: a first die (201) having a first hole (206), and a second die (202) stacked on the first die (201), having a second MEMS device (210), wherein the second MEMS device (210) is connected outside via the first hole (206).

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Inventors:
ZOU QUANBO (CN)
Application Number:
PCT/CN2015/093730
Publication Date:
May 11, 2017
Filing Date:
November 03, 2015
Export Citation:
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Assignee:
GOERTEK INC (CN)
International Classes:
H01L23/02; H01L25/00; H04R19/04
Foreign References:
CN102685657A2012-09-19
CN101308803A2008-11-19
CN103454052A2013-12-18
US20090129622A12009-05-21
US20080157238A12008-07-03
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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