Title:
A MEMS PACKAGE USING FLEXIBLE SUBSTRATES, AND METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO2007010361
Kind Code:
A8
Abstract:
A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device (40) located on a flexible substrate (10). A metal structure (54, 56) surrounds the at least one MEMS device (40) wherein a bottom surface of the metal structure (54, 56) is attached to the flexible substrate (10) and wherein a portion of the flexible substrate (10) is folded over a top surface of the metal structure (54, 56) and attached to the top surface of the metal structure thereby forming the MEMS package.
Inventors:
WANG ZHE (SG)
MIAO YUBO (SG)
MIAO YUBO (SG)
Application Number:
PCT/IB2006/001966
Publication Date:
March 06, 2008
Filing Date:
July 17, 2006
Export Citation:
Assignee:
SILICON MATRIX PTE LTD (SG)
WANG ZHE (SG)
MIAO YUBO (SG)
WANG ZHE (SG)
MIAO YUBO (SG)
International Classes:
B81B7/00
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