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Title:
MEMS PIEZOELECTRIC LOUDSPEAKER WITH SOFT SUPPORT STRUCTURE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/144369
Kind Code:
A1
Abstract:
An MEMS piezoelectric loudspeaker with a soft support structure and a preparation method therefor. The MEMS piezoelectric loudspeaker comprises: a substrate (10), wherein a central region is a hollow region; a composite dielectric film layer (20) located above the substrate (10), wherein the interior includes an annular groove (40), and the annular groove (40) is located above the hollow region; a piezoelectric unit (30) located above the composite dielectric film layer (20) inside the annular groove (40), and a soft support film layer (50) covering the annular groove (40), wherein the composite dielectric film layer (20), the piezoelectric unit (30), and the soft support film layer (50) located inside the annular groove (40) constitute a composite piezoelectric vibration film having a soft support structure. The vibration film stress of the MEMS piezoelectric loudspeaker with a soft support structure is released, the vibration amplitude is high during operation, the sensitivity is relatively high, and the preparation process is simple.

Inventors:
LIU, Duan (Room 404, Building 19 No. 102 Friendship Road, Haidian District, Beijing 4, 100094, CN)
Application Number:
CN2018/074276
Publication Date:
August 01, 2019
Filing Date:
January 26, 2018
Export Citation:
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Assignee:
LIU, Duan (Room 404, Building 19 No. 102 Friendship Road, Haidian District, Beijing 4, 100094, CN)
International Classes:
H04R17/00
Foreign References:
CN101645484A2010-02-10
CN101646117A2010-02-10
CN107032291A2017-08-11
JP2008035159A2008-02-14
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (Suite 4-1105, No. 87 West 3rd Ring North Rd., Haidian District, Beijing 9, 100089, CN)
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