MEMS PRESSURE GAUGE CHIP AND MANUFACTURING METHOD THEREOF

WIPO Patent Application WO/2017/028465

A1

A pressure gauge, comprising a cavity body (33) and a MEMS pressure gauge chip provided therein, the pressure gauge chip comprising a substrate (1), a component portion (2) and a covering plate (3) connected to each other. A silica layer (4) is formed between the substrate (1) and the component portion (2) and between the component portion (2) and the covering plate (3). The substrate (1) and the covering plate (3) are respectively formed with recess portions (5) thereon. The recess portion (5) of the substrate (1) is connected to the recess portion (5) of the covering plate (3) to form a cavity, and the component portion (2) is disposed within the cavity. The component portion (2) comprises a bridge portion (21) and a piezoresistive measuring element (23). The piezoresistive measuring element (23) is provided on the bridge portion (21). The pressure gauge chip is not greatly affected by temperature, can be used in a high temperature environment, has a high detection accuracy, high reliability and a low manufacturing cost. Also disclosed is a MEMS pressure gauge chip manufacturing process.

CHAU KEVIN (CN)
WONG MAN (CN)

PCT/CN2016/000369

February 23, 2017

July 08, 2016

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INST GEOLOGY & GEOPHYSICS CAS (CN)

G01L9/04; B81B3/00; B81C1/00; B81C3/00; G01B7/16

CN105241600A	2016-01-13
CN105241369A	2016-01-13
CN103674355A	2014-03-26
CN101419227A	2009-04-29
CN104062464A	2014-09-24
US20100005886A1	2010-01-14

BEIJING GOLDEN BRIDGE IP AGENCY CO., LTD. (CN)

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