Title:
MEMS SENSOR CHIP, MICROPHONE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/135003
Kind Code:
A1
Abstract:
Disclosed are an MEMS sensor chip, a microphone and an electronic device. The MEMS sensor chip comprises a substrate, an induction assembly and an annular protective layer, wherein the substrate has a cavity; the induction assembly comprises a first annular support layer, a second annular support layer, a vibrating diaphragm, and a back plate which has a through hole; the first annular support layer is arranged on the substrate; the first annular support layer, the back plate, the second annular support layer and the vibrating diaphragm are sequentially stacked in a direction away from the substrate; the annular protective layer is arranged on a peripheral side of the induction assembly; and the annular protective layer at least covers the first annular support layer and/or the second annular support layer.
Inventors:
QIU GUANXUN (CN)
LIU SONG (CN)
ZHOU ZONGLIN (CN)
LIU SONG (CN)
ZHOU ZONGLIN (CN)
Application Number:
PCT/CN2021/132768
Publication Date:
June 30, 2022
Filing Date:
November 24, 2021
Export Citation:
Assignee:
GOERTEK MICROELECTRONICS INC (CN)
International Classes:
H04R19/04
Foreign References:
| CN213847003U | 2021-07-30 | |||
| CN109151689A | 2019-01-04 | |||
| CN208429863U | 2019-01-25 | |||
| US20100096714A1 | 2010-04-22 | |||
| JP2007267081A | 2007-10-11 | |||
| CN108810776A | 2018-11-13 | |||
| CN106535071A | 2017-03-22 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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