Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MEMS SENSOR PACKAGING AND METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2013/070013
Kind Code:
A1
Abstract:
The present invention relates to a MEMS sensor packing and a method thereof. The MEMS sensor packaging includes: a first wafer on which on an ROIC circuit is disposed; a second wafer disposed to correspond to the first wafer and having a concave portion in one surface thereof to provide a MEMS sensor; a bonding solder disposed around the MEMS sensor to bond the first and second wafers to each other, thereby sealing the MEMS sensor; and a solder pad electrically connecting the ROIC circuit of the first wafer to the MEMS sensor of the second wafer. According to the present invention, when the wafer on which the ROIC circuit is disposed and the wafer on which the MEMS sensor is disposed are bonded to package the bonded wafers, the solder pad for electrically connecting the ROIC sensor to the MEMS sensor may be provided within the package to reduce the size of the package and stably supply an electrical signal.

Inventors:
HAN YONG HEE (KR)
KIM HYUNG WON (KR)
AHN MI SOOK (KR)
Application Number:
PCT/KR2012/009447
Publication Date:
May 16, 2013
Filing Date:
November 09, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ELECTRONICS CO LTD U (KR)
International Classes:
B81C1/00; B81B7/02; G01P15/00; H01L21/48
Foreign References:
JP2007516092A2007-06-21
JP2003520447A2003-07-02
KR100705007B12007-04-09
US20060244085A12006-11-02
Other References:
See also references of EP 2778120A4
Attorney, Agent or Firm:
KO, Young Kap et al. (KR)
고영갑 (KR)
Download PDF:
Claims: