MEMS SENSOR

WIPO Patent Application WO/2011/111541

A1

Disclosed is a MEMS sensor that, in particular, can increase sealing airtightness and bonding strength at an Al-Ge eutectic bonding interface of a sealing/bonding section. The MEMS sensor is configured having: a first substrate; a second substrate; and a sealing/bonding section that is positioned between the aforementioned first substrate and the aforementioned second substrate, and that is formed from the eutectic bonding of a first connecting metal layer formed on the aforementioned first substrate side and a second connecting metal layer formed on the aforementioned second substrate side. In the aforementioned sealing/bonding section (50), from the aforementioned first substrate side to the aforementioned second substrate side, a Ti layer (52), a Ta layer (53), the aforementioned first connecting metal layer (54) formed from Al or an Al alloy, and the aforementioned second connecting metal layer (55) formed from Ge are stacked in the given order.

MIYATAKE AKIRA (JP)
KOBAYASHI TOSHIHIRO (JP)
UTO YOSHITAKA (JP)
YAZAWA HISAYUKI (JP)
TAKAHASHI TORU (JP)

PCT/JP2011/054115

September 15, 2011

February 24, 2011

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ALPS ELECTRIC CO LTD (JP)
MIYATAKE AKIRA (JP)
KOBAYASHI TOSHIHIRO (JP)
UTO YOSHITAKA (JP)
YAZAWA HISAYUKI (JP)
TAKAHASHI TORU (JP)

G01P15/08; B81B3/00; B81C3/00; G01P15/125; H01L23/02; H01L29/84

WO2006101769A2

2006-09-28

US7276789B1	2007-10-02
JP2002328137A	2002-11-15
JP2005249454A	2005-09-15
JP2010171368A	2010-08-05
JP2006344573A	2006-12-21

NOZAKI, Teruo et al. (JP)
Teruo Nozaki (JP)

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