Title:
MEMS SENSOR
Document Type and Number:
WIPO Patent Application WO/2013/046955
Kind Code:
A1
Abstract:
The present invention has a signal-processing LSI in which is installed a temperature sensor for measuring the sensor temperature, and a MEMS sensor chip installed on the signal-processing LSI; the MEMS sensor chip being installed on the heat-generating unit of the signal-processing LSI. It is thereby possible to provide a MEMS sensor in which the effect of the change in temperature characteristics due to heat is reduced.
Inventors:
OHSAKA ICHIRO (JP)
OHTA KAZUNORI (JP)
OHTA KAZUNORI (JP)
Application Number:
PCT/JP2012/070420
Publication Date:
April 04, 2013
Filing Date:
August 10, 2012
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
OHSAKA ICHIRO (JP)
OHTA KAZUNORI (JP)
OHSAKA ICHIRO (JP)
OHTA KAZUNORI (JP)
International Classes:
G01P15/08; G01C19/5783; G01P1/02; G01P21/00
Foreign References:
| JP2009053100A | 2009-03-12 | |||
| JPH1010148A | 1998-01-16 |
Attorney, Agent or Firm:
HIRAKI Yusuke et al. (JP)
Yusuke Hiraki (JP)
Yusuke Hiraki (JP)
Download PDF:
Claims: