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Patent Searching and Data


Title:
MEMS SENSOR
Document Type and Number:
WIPO Patent Application WO/2013/046955
Kind Code:
A1
Abstract:
The present invention has a signal-processing LSI in which is installed a temperature sensor for measuring the sensor temperature, and a MEMS sensor chip installed on the signal-processing LSI; the MEMS sensor chip being installed on the heat-generating unit of the signal-processing LSI. It is thereby possible to provide a MEMS sensor in which the effect of the change in temperature characteristics due to heat is reduced.

Inventors:
OHSAKA Ichiro (HITACHI LTD., 18-13, Sotokanda 1-chome, Chiyoda-k, Tokyo 08, 〒1018608, JP)
大坂 一朗 (〒08 東京都千代田区外神田一丁目18番13号 株式会社日立製作所 モノづくり技術事業部内 Tokyo, 〒1018608, JP)
Application Number:
JP2012/070420
Publication Date:
April 04, 2013
Filing Date:
August 10, 2012
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS, LTD. (2520, Takaba Hitachinaka-sh, Ibaraki 03, 〒3128503, JP)
日立オートモティブシステムズ株式会社 (〒03 茨城県ひたちなか市高場2520番地 Ibaraki, 〒3128503, JP)
OHSAKA Ichiro (HITACHI LTD., 18-13, Sotokanda 1-chome, Chiyoda-k, Tokyo 08, 〒1018608, JP)
International Classes:
G01P15/08; G01C19/5783; G01P1/02; G01P21/00
Foreign References:
JP2009053100A
JPH1010148A
Attorney, Agent or Firm:
HIRAKI Yusuke et al. (Atago Green Hills MORI Tower 32F, 5-1 Atago 2-chome, Minato-k, Tokyo 32, 〒1056232, JP)
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Claims:



 
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