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Patent Searching and Data


Title:
MEMS SOUND SENSOR, MEMS MICROPHONE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/133352
Kind Code:
A1
Abstract:
An MEMS sound sensor, for use in detecting sound by means of at least one of air sound pressure change and mechanical vibration. The MEMS sound sensor comprises: a back plate; a diaphragm opposite to the back plate and having a gap with the back plate, the diaphragm and the back plate constituting a capacitor structure; and a connecting post, comprising a first end and a second end opposite to each other, the first end of the connecting post being fixedly connected to the back plate, and the second end of the connecting post being electrically connected to a middle region of the diaphragm to suspend the diaphragm on the back plate. An edge area of the diaphragm is provided with at least one mass block; the back plate is provided with an opening; the opening is used for exposing the mass block so as to form a gap between the mass block and the back plate, or the opening is used as a sound hole on the back plate.

Inventors:
HO HSIEN-LUNG (CN)
HSIEH KUAN-HONG (CN)
CHIU SHIH-CHIA (CN)
Application Number:
PCT/CN2018/125351
Publication Date:
July 02, 2020
Filing Date:
December 29, 2018
Export Citation:
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Assignee:
GETTOP ACOUSTIC CO LTD (CN)
International Classes:
H04R31/00; B81C1/00; H04R19/04
Foreign References:
CN102822084A2012-12-12
CN102822084A2012-12-12
CN108513241A2018-09-07
CN108513241A2018-09-07
US20090280594A12009-11-12
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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