Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MESH STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/065207
Kind Code:
A1
Abstract:
Provided is a mesh structure of one embodiment of the present invention that reinforces the connection portions of mesh and suppresses a deterioration in quality by using a plating film. This mesh structure comprises an insulation film formed on the upper surface of the mesh, and a plating film that is formed on the lower surface of the mesh and that fixes the intersections of fiber threads in the mesh. The mesh structure is used for various applications such as a printing stencil. The insulation film functions as a masking film when forming the plating film.

Inventors:
CHOUSA Chinatsu (2947-1, Kuragano-machi, Takasaki-sh, Gunma 01, 〒3701201, JP)
SHIBUSAWA Kunihiko (2947-1, Kuragano-machi, Takasaki-sh, Gunma 01, 〒3701201, JP)
Application Number:
JP2013/078293
Publication Date:
May 01, 2014
Filing Date:
October 18, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TAIYO CHEMICAL INDUSTRY CO., LTD. (2947-1, Kuragano-machi Takasaki-sh, Gunma 01, 〒3701201, JP)
International Classes:
C25D7/00; B41N1/24; C23C18/31; C25D5/02
Foreign References:
JP2005200794A2005-07-28
JPS6289898A1987-04-24
JPS58220884A1983-12-22
JPH0980756A1997-03-28
JPS6059187A1985-04-05
JPH03152269A1991-06-28
JP2012006390A2012-01-12
Attorney, Agent or Firm:
MURAKOSHI Satoshi (Pillsbury Winthrop Shaw Pittman LLP, 20F Marunouchi Eiraku Building, 4-1, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
Download PDF: