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Patent Searching and Data


Title:
METAL ALLOY WIRE FOR CHAIN MANUFACTURING, MANUFACTURING METHOD FOR SAME, AND METAL ALLOY CHAIN
Document Type and Number:
WIPO Patent Application WO/2023/238744
Kind Code:
A1
Abstract:
Provided are a metal alloy wire for chain manufacturing and a high quality and high-grade metal alloy chain by which it is possible to reduce the occurrence of shape deformation or defects in a chain link, and to increase the yield of a machine chain. Provided is a manufacturing method for a metal alloy wire for chain manufacturing by which it is possible to increase the yield of a machine chain. The metal alloy wire for chain manufacturing comprises an alloy with a metal content of 99.8% by mass or greater. The metal alloy contains a total of 50 to 1500 ppm by mass of one or more elements selected from a group consisting of Ce, Eu, Gd, La, Y, and Ca in relation to the total quantity. The maximum proof strength of the metal alloy wire is 330 MPa or greater, and the 3σ of the maximum proof strength is 30 or less.

Inventors:
CHEN WEI (JP)
MIKAMI MICHITAKA (JP)
ITO ANNA (JP)
TAKEDA HIDEYUKI (JP)
NAKASHIMA SHINICHIRO (JP)
NISHIYAMA YUJI (JP)
Application Number:
PCT/JP2023/020188
Publication Date:
December 14, 2023
Filing Date:
May 30, 2023
Export Citation:
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Assignee:
TANAKA ELECTRONICS IND (JP)
International Classes:
C22C5/02; B21C1/00; C22F1/00; C22F1/14
Foreign References:
JPH0770671A1995-03-14
JPH07265112A1995-10-17
JPH0726340A1995-01-27
JPH08188840A1996-07-23
JPH093570A1997-01-07
JPH06179931A1994-06-28
JPH08157983A1996-06-18
JPH07242961A1995-09-19
Attorney, Agent or Firm:
KOBAYASHI Takumi (JP)
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