METAL BASE CIRCUIT BOARD, LED, AND LED LIGHT SOURCE UNIT

Title:

METAL BASE CIRCUIT BOARD, LED, AND LED LIGHT SOURCE UNIT

Document Type and Number:

WIPO Patent Application WO/2006/112478

Kind Code:

A1

Abstract:

A metal base circuit board capable of being not only installed to a flat portion but closely attached to a side surface or a bottom surface of a case or to a curved surface, and being excellent in heat dissipation capacity, electric insulation capacity and flexibility and a production method thereof, and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source unit using it. A metal base circuit board which is a circuit board comprising insulating layers and conductive circuits or metal foils that are laminated alternately, characterized in that the thickness of the conductive circuit or a metal foil is 5μm through 450μm, the insulating layer consists of a hardening material of a resin composition containing inorganic filler and thermosetting resin, and the thickness of the insulating layer is 9μm through 300μm; and a hybrid integrated circuit using it. Or, a metal base circuit board comprising a layer having a coverlay and magnetic loss or a layer having dielectric loss. Further, a metal base circuit board comprising at least one light emitting diode (LED) mounted on the above conductive circuit.

Inventors:

OKAJIMA YOSHIHIKO (JP)
YASHIMA KATSUNORI (JP)
TAKANO KEIJI (JP)
OKADA TAKUYA (JP)

Application Number:

PCT/JP2006/308221

Publication Date:

October 26, 2006

Filing Date:

April 19, 2006

Export Citation:

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Assignee:

DENKI KAGAKU KOGYO KK (JP)
OKAJIMA YOSHIHIKO (JP)
YASHIMA KATSUNORI (JP)
TAKANO KEIJI (JP)
OKADA TAKUYA (JP)

International Classes:

H05K1/05; F21K99/00

Foreign References:

JP2005064168A	2005-03-10
JP2001223450A	2001-08-17
JPH08323916A	1996-12-10
JPS63205986A	1988-08-25
JPH10242607A	1998-09-11
JP2001151862A	2001-06-05
JPS61295691A	1986-12-26
JPH02260598A	1990-10-23
JP2005097393A	2005-04-14
JP2004010859A	2004-01-15

Other References: