Title:
METAL BASE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/151122
Kind Code:
A1
Abstract:
This metal base substrate, in which a metal substrate (10), an insulating layer (20), and a metal foil (40) are laminated in this order, is characterized by having an adhesive layer (30) between the insulating layer (20) and the metal foil (40), wherein the adhesive layer (30) satisfies formulae (1) to (3) when a Young's modulus at 25°C represented in units of GPa is E, a thickness represented in units of μm is T, and a heat conductivity in the thickness direction represented in units of W/mK is λ.
Inventors:
ISHIKAWA FUMIAKI (JP)
YAMASAKI KAZUHIKO (JP)
YAMASAKI KAZUHIKO (JP)
Application Number:
PCT/JP2019/002383
Publication Date:
August 08, 2019
Filing Date:
January 24, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H05K1/05; H01L23/36; H05K3/38
Domestic Patent References:
| WO2010092905A1 | 2010-08-19 |
Foreign References:
| JP2015043417A | 2015-03-05 | |||
| JP2004335928A | 2004-11-25 | |||
| JP2006270065A | 2006-10-05 | |||
| JPH1187866A | 1999-03-30 | |||
| JP2018013889A | 2018-01-25 | |||
| JP2013143440A | 2013-07-22 |
Other References:
See also references of EP 3749069A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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