Title:
METAL BASE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/017550
Kind Code:
A1
Abstract:
A metal base substrate (2) obtained by layering, in this order, a metal substrate (10), an insulating layer (20), and a circuit layer (40), wherein the insulating layer (20) contains a resin, the circuit layer (40) exhibits a film thickness in the range of 10-1,000μm, inclusive, and formula (1) is satisfied when the average crystalline particle diameter is expressed in units of μm and the purity is expressed in units of mass%. (1): average crystalline particle diameter/(100-purity)>5.
More Like This:
Inventors:
ISHIKAWA FUMIAKI (JP)
NONAKA SOHEI (JP)
NONAKA SOHEI (JP)
Application Number:
PCT/JP2019/028080
Publication Date:
January 23, 2020
Filing Date:
July 17, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H05K1/05; B32B15/08; H01B5/14; H01L23/12; H01L23/14
Foreign References:
JP2011146679A | 2011-07-28 | |||
JP2000256081A | 2000-09-19 | |||
JP2007201359A | 2007-08-09 | |||
JP2006128286A | 2006-05-18 | |||
JP2018134789A | 2018-08-30 | |||
JP5665449B2 | 2015-02-04 | |||
JP2017152610A | 2017-08-31 |
Other References:
See also references of EP 3826436A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF: