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Patent Searching and Data


Title:
METAL BASE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/017550
Kind Code:
A1
Abstract:
A metal base substrate (2) obtained by layering, in this order, a metal substrate (10), an insulating layer (20), and a circuit layer (40), wherein the insulating layer (20) contains a resin, the circuit layer (40) exhibits a film thickness in the range of 10-1,000μm, inclusive, and formula (1) is satisfied when the average crystalline particle diameter is expressed in units of μm and the purity is expressed in units of mass%. (1): average crystalline particle diameter/(100-purity)>5.

Inventors:
ISHIKAWA FUMIAKI (JP)
NONAKA SOHEI (JP)
Application Number:
PCT/JP2019/028080
Publication Date:
January 23, 2020
Filing Date:
July 17, 2019
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H05K1/05; B32B15/08; H01B5/14; H01L23/12; H01L23/14
Foreign References:
JP2011146679A2011-07-28
JP2000256081A2000-09-19
JP2007201359A2007-08-09
JP2006128286A2006-05-18
JP2018134789A2018-08-30
JP5665449B22015-02-04
JP2017152610A2017-08-31
Other References:
See also references of EP 3826436A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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