METAL BODY, FITTING-TYPE CONNECTION TERMINAL, AND METAL BODY FORMING METHOD

Title:

METAL BODY, FITTING-TYPE CONNECTION TERMINAL, AND METAL BODY FORMING METHOD

Document Type and Number:

WIPO Patent Application WO/2021/166467

Kind Code:

A1

Abstract:

Provided are: a metal body for which whisker generation as a result of being subjected to external stress is suppressed, and which can be easily manufactured; a fitting-type connection terminal; and a metal body formation method. This metal body is configured so that a barrier layer containing Ni as a main component is formed on a metal substrate containing Cu as a main component. A metal plating layer containing Sn as a main component is formed directly above the barrier layer. In a cross section of the metal body, the area ratio, i.e., the ratio of the area of an intermetallic compound containing Sn and Cu in the metal plating layer to the cross-sectional area of the metal plating layer, is 20% or less.

Inventors:

IWAMOTO HIROYUKI (JP)
MUNEKATA OSAMU (JP)
TSURUTA KAICHI (JP)
NAKAMURA KATSUJI (JP)
KONDOH SHIGEKI (JP)
TSUCHIYA MASATO (JP)

Application Number:

PCT/JP2020/049267

Publication Date:

August 26, 2021

Filing Date:

December 28, 2020

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

C25D5/12; C25D5/18; C25D7/00; H01R13/03

Domestic Patent References:

WO2012067202A1

2012-05-24

Foreign References:

JP2019031732A	2019-02-28
JP2000169997A	2000-06-20
JPH04329891A	1992-11-18
JP2006193778A	2006-07-27
JPH04254597A	1992-09-09
JP2004204308A	2004-07-22
JP2006307328A	2006-11-09
JP2014122403A	2014-07-03
JP2006307328A	2006-11-09
JPS63118093A	1988-05-23
JP2004204308A	2004-07-22

Other References: