Title:
METAL BOND GRINDING WHEEL FOR VERY HARD AND BRITTLE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/158631
Kind Code:
A1
Abstract:
Provided is a long-lived grinding wheel that can grind a very hard and brittle material with high efficiency. A segmented grinding wheel 14, which is a metal bond grinding wheel for a very hard and brittle material, is provided with pores 22 having pore diameters of 50-200 μm at a porosity of 50-65 vol% relative to the entire segmented grinding wheel 14. Providing a pore diameter of 50-200 μm and a porosity of 50-65 vol% inhibits increased machining resistance and metal bond brittleness, and enables suitable grinding by increasing the contact surface pressure against a ground material 30. Furthermore, because a metal bond 20 is a porous structure comprising the pores 22 described above, the discharging performance and cooling performance of chips 32 can be increased during grinding due to the pores 22 serving as chip pockets, and the erosion performance of the metal bond 20 in a grinding surface can be increased.
Inventors:
FURUNO DAIKI (JP)
SHINKAI IBUKI (JP)
YAMAGUCHI MASARU (JP)
SHINKAI IBUKI (JP)
YAMAGUCHI MASARU (JP)
Application Number:
PCT/JP2020/002631
Publication Date:
August 06, 2020
Filing Date:
January 24, 2020
Export Citation:
Assignee:
NORITAKE CO LTD (JP)
International Classes:
B24D3/00; B24D3/06; B24D3/10
Foreign References:
| JP2010540261A | 2010-12-24 | |||
| JP2014205225A | 2014-10-30 | |||
| JP2012178617A | 2012-09-13 |
Attorney, Agent or Firm:
IKEDA Haruyuki et al. (JP)
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