Title:
METAL-BONDED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/117851
Kind Code:
A1
Abstract:
The present invention relates to a metal-bonded substrate and, more specifically, to a metal-bonded substrate in which the bonding force between a nonconductive substrate and a metal layer bonded to each other is remarkably improved. To this end, the present invention provides a metal-bonded substrate comprising: a substrate; a metal layer formed on the substrate; and a self-assembled monomolecular layer formed between the substrate and the metal layer, and composed of a silane chemically linking the substrate and the metal layer, wherein the end group of the silane is composed of an aminosilane containing a saturated or unsaturated hetero atom of a six-membered ring.
Inventors:
KIM BO GYEONG (KR)
KIM HYUN BIN (KR)
LEE SUNG HOON (KR)
KIM HYUN BIN (KR)
LEE SUNG HOON (KR)
Application Number:
PCT/KR2016/000085
Publication Date:
July 28, 2016
Filing Date:
January 06, 2016
Export Citation:
Assignee:
CORNING PREC MATERIALS CO LTD (KR)
International Classes:
B32B7/12; B32B15/20; B32B17/06
Foreign References:
| KR20040063367A | 2004-07-14 | |||
| KR100841170B1 | 2008-06-24 | |||
| KR20130041720A | 2013-04-25 | |||
| KR101423349B1 | 2014-07-24 | |||
| KR100862149B1 | 2008-10-09 |
Attorney, Agent or Firm:
KIM, SEON-MIN (KR)
김선민 (KR)
김선민 (KR)
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