Title:
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/209024
Kind Code:
A1
Abstract:
This metal-ceramic bonded substrate, in which a metal plate is bonded to one surface of a ceramic substrate and a metal base plate is bonded to the other surface thereof, is characterized in that a side surface of a plate-shaped reinforcing member comprising a metal having a higher strength than that of the metal base plate is bonded to a side surface of the metal base plate. Thus, it is possible to provide a metal-ceramic bonded substrate and a manufacturing method therefor with which cracking of the ceramic substrate can be suppressed and warpage can be adequately suppressed even when a thermal history is applied.
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Inventors:
HIGO MASAAKI (JP)
IDEGUCHI SATORU (JP)
IDEGUCHI SATORU (JP)
Application Number:
PCT/JP2021/045174
Publication Date:
October 06, 2022
Filing Date:
December 08, 2021
Export Citation:
Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
B22D19/00; C04B37/00; H01L23/12; H01L23/13; H01L23/36
Domestic Patent References:
| WO2016121660A1 | 2016-08-04 |
Foreign References:
| JP2020072130A | 2020-05-07 | |||
| JP2016187009A | 2016-10-27 | |||
| JP2009200258A | 2009-09-03 | |||
| JP2017228551A | 2017-12-28 |
Attorney, Agent or Firm:
HAGIWARA, Yasushi et al. (JP)
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