Title:
METAL-CERAMIC BONDED SUBSTRATE, MANUFACTURING METHOD THEREOF, AND BRAZING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/276466
Kind Code:
A1
Abstract:
Provided is a metal-ceramic bonded substrate in which a metal plate is bonded to a ceramic substrate through a brazing material. The metal plate and the ceramic substrate are bonded through a brazing material comprising: at least one type of element selected from elements for which a value of a Fleischer mismatch parameter is 1.2 or less; at least one type of active metal component; and Cu and Ag. The void fraction at the bonding interface between the metal plate and the ceramic substrate is 1.0 area% or less.
Inventors:
YUKI SEIYA (JP)
TERAMOTO YUKI (JP)
TERAMOTO YUKI (JP)
Application Number:
PCT/JP2022/020152
Publication Date:
January 05, 2023
Filing Date:
May 13, 2022
Export Citation:
Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C22C5/06; B23K35/30; B23K35/363; C04B37/02; C22C9/00; C22C30/02
Domestic Patent References:
| WO2018221493A1 | 2018-12-06 | |||
| WO2008004552A1 | 2008-01-10 | |||
| WO2017213207A1 | 2017-12-14 |
Foreign References:
| JP2005035874A | 2005-02-10 | |||
| JPH07126079A | 1995-05-16 | |||
| JPH02179390A | 1990-07-12 | |||
| CN102319964A | 2012-01-18 | |||
| JP2012115846A | 2012-06-21 | |||
| JP2008509817A | 2008-04-03 | |||
| JPS56163093A | 1981-12-15 |
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
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