Title:
METAL CLAD BODY, CIRCUIT BOARD AND ELECTRONIC PART
Document Type and Number:
WIPO Patent Application WO/2010/032780
Kind Code:
A1
Abstract:
Provided are a metal clad body, circuit board and electronic part with which there is a reduction in thermal strain caused by the soldering heat when a semiconductor element is fitted to a circuit board formed by removing conductors by etching, and connection reliability is improved. The metal clad body has a film base and a metal layer comprising copper (Cu) or copper alloy (Cu alloy), and the thermal strain caused by the soldering heat when a semiconductor element is fitted to a circuit board can be reduced by using a metal clad body expanded by from 0.05 to 0.4% in the planar direction with heat treatment following removal of the metal layer by etching. Highly reliable circuit boards and electronic parts can be produced using such a metal clad body.
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Inventors:
ZAMA SATORU (JP)
OHGA KENICHI (JP)
FUJISAWA KIMIKO (JP)
SUZUKI YUJI (JP)
OHGA KENICHI (JP)
FUJISAWA KIMIKO (JP)
SUZUKI YUJI (JP)
Application Number:
PCT/JP2009/066239
Publication Date:
March 25, 2010
Filing Date:
September 17, 2009
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
ZAMA SATORU (JP)
OHGA KENICHI (JP)
FUJISAWA KIMIKO (JP)
SUZUKI YUJI (JP)
ZAMA SATORU (JP)
OHGA KENICHI (JP)
FUJISAWA KIMIKO (JP)
SUZUKI YUJI (JP)
International Classes:
B32B15/08; B32B15/088; H01L21/60
Foreign References:
| JP2001270034A | 2001-10-02 | |||
| JP2005199481A | 2005-07-28 | |||
| JP2005205806A | 2005-08-04 |
Attorney, Agent or Firm:
MATSUSHITA, MAKOTO (JP)
Matsushita 亮 (JP)
Matsushita 亮 (JP)
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