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Title:
METAL-CLAD LAMINATE BODY AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/171554
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a metal-clad laminate body capable of suppressing the occurrence of curling, the laminate body also having a low dielectric loss tangent. The present invention is a metal-clad laminate body in which a metal layer (A), a resin layer (B), and a metal layer (C) are layered in that order, wherein the metal-clad laminate body is characterized in that the resin layer (B) comprises a melt-processable fluorine resin, the fluorine resin having a carbonyl-group-containing functional group at a main chain end.

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Inventors:
MURAKAMI SHINYA
YOSHIMOTO HIROYUKI
KAWAHARA KAZUYA
INABA TAKESHI
Application Number:
PCT/JP2014/061203
Publication Date:
October 23, 2014
Filing Date:
April 21, 2014
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
B32B15/082; B32B15/08; H05K1/03
Domestic Patent References:
WO2013042781A12013-03-28
WO2010084867A12010-07-29
Foreign References:
JP2005007668A2005-01-13
JP2006069074A2006-03-16
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
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