Title:
METAL-CLAD LAMINATE PLATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/136722
Kind Code:
A1
Abstract:
This metal-clad laminate plate (100) has an insulating layer (101) containing a thermosetting resin, a filler, and a fiber base material, and is provided with a metal foil (103) on both sides of the insulating layer (101). When, after the metal foil (103) on both surfaces of this metal-clad laminate plate (100) has been removed by etching, a thermomechanical analysis device is used to make thermomechanical analysis measurements involving [1] a temperature-raising step for raising the temperature from 25°C to 300°C and [2] a temperature-lowering step for lowering the temperature from 300°C to 25°C, the linear expansion coefficients α1, α2 and α3 in the in-plane direction of the insulation layer (101) calculated under the following conditions fulfill α3 > α2 > α1. α1 is the linear expansion coefficient calculated in the range from 25°C to Tg in the temperature-raising step [1], α2 is the linear expansion coefficient calculated in the range from Tg to 300°C in the temperature-raising step [1], and α3 is the linear expansion coefficient calculated in the range from 300°C to 25°C in the temperature-lowering step [2].
Inventors:
OHIGASHI NORIYUKI (JP)
Application Number:
PCT/JP2013/001387
Publication Date:
September 19, 2013
Filing Date:
March 06, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B15/08; B32B17/04; H01L23/14; H05K1/03
Domestic Patent References:
| WO2007121630A1 | 2007-11-01 |
Foreign References:
| JP2008087342A | 2008-04-17 | |||
| JP2012001583A | 2012-01-05 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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