Title:
METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METAL-CLAD LAMINATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/046631
Kind Code:
A1
Abstract:
The metal-clad laminate (100) according to the present invention comprises an insulating layer (101) including a thermosetting resin, a filler material, and a fibre base, and is provided with metal foil (103) on both surfaces of the insulating layer (101). After a heat treatment has been carried out, after the metal foil (103) on both surfaces has been removed by means of etching, the heat treatment comprising (1) a four hour preliminary heat treatment at 105℃ and (2) a five second reflow treatment in which the surface temperature is 260-265℃, the dimensional change of the metal-clad laminate (100), calculated from formulas (1)-(3) below, is -0.080-0% in both the longitudinal direction (105) and the transverse direction (107) of the metal-clad laminate (100). A(%) = (post preliminary heat treatment dimensions - initial dimensions)/initial dimensions x 100 (1); B(%) = (post reflow treatment dimensions - initial dimensions)/initial dimensions x 100 (2); dimensional change(%) = B - A (3). The dimensions of the laminate in each stage are measured at room temperature and in compliance with 2.4.39 of IPC-TM-650.
Inventors:
OHIGASHI NORIYUKI (JP)
Application Number:
PCT/JP2012/006064
Publication Date:
April 04, 2013
Filing Date:
September 24, 2012
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B15/08; H05K1/03
Domestic Patent References:
| WO2007040125A1 | 2007-04-12 |
Foreign References:
| JP2000212308A | 2000-08-02 | |||
| JPH08216335A | 1996-08-27 | |||
| JP2010229313A | 2010-10-14 | |||
| JP2010238907A | 2010-10-21 | |||
| JP2004307811A | 2004-11-04 | |||
| JP2003155362A | 2003-05-27 | |||
| JPH0381122A | 1991-04-05 | |||
| JPH09155863A | 1997-06-17 | |||
| JP2002069886A | 2002-03-08 | |||
| JP2007050599A | 2007-03-01 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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Claims: