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Patent Searching and Data


Title:
METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/012445
Kind Code:
A1
Abstract:
The objective of the present invention is to provide: a metal-clad laminate which has excellent heat dissipation properties and flexibility, and wherein an insulating layer comprises a graphite sheet as a heat dissipation material and is capable of suppressing breakage of the graphite sheet; and a printed wiring board. A metal-clad laminate (1) according to the present invention is provided with a conductor layer (10) and an insulating layer (20) that is superposed on the conductor layer (10). The insulating layer (20) comprises a base material (21) having electrical insulation properties and a graphite sheet (22) which is embedded in the base material (21). The insulating layer (20) has a thermal conductivity of 100 W/m·K or more. This metal-clad laminate (1) has a folding endurance of 3 folds or more as evaluated by a folding endurance test with a curvature radius of 3 mm.

Inventors:
OZEKI TAKAYOSHI
ESAKI YOSHIAKI
HIRAKA MASAHIRO
AOKI TOMOYUKI
USHIJIMA HIDEHARU
KOMORI KIYOTAKA
Application Number:
PCT/JP2017/025081
Publication Date:
January 18, 2018
Filing Date:
July 10, 2017
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B7/02; B32B15/08; B32B15/088; H05K1/03
Domestic Patent References:
WO2014013711A12014-01-23
WO2013047341A12013-04-04
Foreign References:
JP2007039567A2007-02-15
JP2002273741A2002-09-25
JP2012000960A2012-01-05
JP2010238990A2010-10-21
Other References:
BALANDIN ALEXANDER A.: "The Heat Is On:Graphene Applications", IEEE NANOTECHNOLOGY MAGAZINE, vol. 5, no. 4, December 2011 (2011-12-01), pages 15 - 19, XP011369683
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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