METAL-CLAD LAMINATED BOARD AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2023/189794

A1

This metal-clad laminated board 100 has a structure that (a metal layer 10A)/(an adhesive layer 20A)/(an inorganic filler-containing fluororesin layer 30)/(an adhesive layer 20B)/(a metal layer 10B) are laminated in this order. The metal-clad laminated board 100 satisfies either one of the requirements (a) and (b): (a) when a main resin constituting the adhesive layer 20A, 20B is a crystalline resin, the melting point Tm1 of the adhesive layer 20A, 20B is higher than the melting point Tm2 of the inorganic filler-containing fluororesin layer 30; and (b) when the main resin constituting the adhesive layer 20A, 20B is an amorphous resin, the storage modulus E' of the adhesive layer 20A, 20B at the melting point Tm2 of the inorganic filler-containing fluororesin layer 30 is 1×106Pa or more. In the metal-clad laminated board 100, the thermal expansion coefficient of the inorganic filler-containing fluororesin layer is 60 ppm/K or less.

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ANDO TOMONORI (JP)
NISHIYAMA TEPPEI (JP)

PCT/JP2023/010803

October 05, 2023

March 20, 2023

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NIPPON STEEL CHEMICAL & MAT CO LTD (JP)

B32B7/12; B32B27/20; B32B15/082; B32B27/30; H05K1/03

JP2017024265A	2017-02-02
JP2021070160A	2021-05-06
JP2011137126A	2011-07-14

WATANABE Kazuhiro (JP)

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