Title:
METAL-CLAD LAMINATED PLATE AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2012/172776
Kind Code:
A1
Abstract:
This metal-clad laminated plate (11) is provided with an insulation layer (12), and a metal layer (13) located at least on one surface side of the insulation layer (12), wherein the insulation layer (12) is formed by laminating at least two layers which are a first resin layer (14) and a second resin layer (15) located between the first resin layer (14) and the metal layer (13), the first resin layer (14) and the second resin layer (15) contain hardened materials of respective resin compositions, the resin composition of the first resin layer (14) is different from the resin composition of the second resin layer (15), and the relative permittivity of the hardened material of the resin composition contained in the second layer (15) is lower than the relative permittivity of the hardened material of the resin composition contained in the first resin layer (14).
Inventors:
INOUE HIROHARU
KISHINO KOJI
KISHINO KOJI
Application Number:
PCT/JP2012/003811
Publication Date:
December 20, 2012
Filing Date:
June 12, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
INOUE HIROHARU
KISHINO KOJI
INOUE HIROHARU
KISHINO KOJI
International Classes:
B32B15/08; H05K1/03
Foreign References:
| JP2008201124A | 2008-09-04 | |||
| JPH07232403A | 1995-09-05 | |||
| JPH0424986A | 1992-01-28 | |||
| JP2006059865A | 2006-03-02 | |||
| JPH0424985A | 1992-01-28 | |||
| JPH05167211A | 1993-07-02 | |||
| JPH08186376A | 1996-07-16 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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Claims:
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