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Patent Searching and Data


Title:
METAL COATING FILM AND ELECTRONIC COMPONENT PROVIDED WITH METAL COATING FILM
Document Type and Number:
WIPO Patent Application WO/2013/172155
Kind Code:
A1
Abstract:
Provided are: a metal coating film which has excellent solder joint characteristics and is not susceptible to the formation of Sn whiskers; and an electronic component which is provided with this metal coating film. A metal coating film (1) is configured of a base member (2), an intermetallic compound layer (4) and an Sn plating layer (6). The base member (2) is formed by, for example, electrolytic plating. The mass ratio Cu/(Cu + Ni) of the base member (2) is 0.7-0.97, preferably 0.85-0.95. The intermetallic compound layer (4) is arranged between the base member (2) and the Sn plating layer (6). The intermetallic compound layer (4) is an alloy layer that is mainly composed of Cu, Ni and Sn. The intermetallic compound layer (4) is formed at the boundary between the base member (2) and the Sn plating layer (6) during an Sn plating process for forming the Sn plating layer (6). The average thickness of the intermetallic compound layer (4) is 0.5 μm or more, preferably 1.0 μm or more. The Sn plating layer (6) is arranged on the surface of the intermetallic compound layer (4). The Sn plating layer (6) is formed by, for example, electrolytic plating.

Inventors:
MEGUMI, Daisuke (Ltd. 10-1 Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
SUNAGA, Tomohiro (Ltd. 10-1 Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
TAKANO, Yoshihiko (Ltd. 10-1 Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
TAKAOKA, Hidekiyo (Ltd. 10-1 Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2013/061844
Publication Date:
November 21, 2013
Filing Date:
April 23, 2013
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
C23C28/02; C25D5/10; C25D7/00; H01G4/232; H01G4/30
Foreign References:
JP2005251762A
JP2011249641A
Attorney, Agent or Firm:
OKADA, Masahiro (3rd Floor Iyo Building, 2-21, Minamihonmachi 4-chome, Chuo-ku, Osaka-sh, Osaka 54, 〒5410054, JP)
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