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Title:
METAL COMPOSITION AND BONDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2016/039056
Kind Code:
A1
Abstract:
This metal composition (105) is provided between a first bonding object (101) and a second bonding object (102). This metal composition (105) contains a metal component (110) and a flux (108). The metal component (110) is composed of a first metal powder (106) that is formed of an Sn-based metal and a second metal powder (107) that is formed of a Cu-based metal having a higher melting point than the Sn-based metal. The flux (108) contains rosin, a solvent, a thixotropy-imparting agent, an activator and the like. If the metal composition (105) is heated and the temperature of the metal composition (105) reaches a temperature that is not less than the melting point of the first metal powder (106), the first metal powder (106) melts. The molten Sn and a CuNi alloy powder form an intermetallic compound phase (109), which is formed of a CuNiSn alloy, by a TLP reaction.

Inventors:
KAWAGUCHI YOSHIHIRO (JP)
Application Number:
PCT/JP2015/072596
Publication Date:
March 17, 2016
Filing Date:
August 10, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B23K35/22; B22F1/10; B23K35/26; B23K35/363
Domestic Patent References:
WO2012108395A12012-08-16
Foreign References:
JPS59212188A1984-12-01
JPH05212579A1993-08-24
JP2014028380A2014-02-13
JPH06182586A1994-07-05
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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