METAL CORE FOLDOVER PACKAGES STRUCTURES, SYSTEMS INCLUDING THE SAME AND METHODS OF FABRICATION

Title:

METAL CORE FOLDOVER PACKAGES STRUCTURES, SYSTEMS INCLUDING THE SAME AND METHODS OF FABRICATION

Document Type and Number:

WIPO Patent Application WO2008027746

Kind Code:

B1

Abstract:

Chip scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion of the core member. Conductive traces extend from one side of the package over the at least one flange member to an opposing side of the package. Systems including the chip scale packages and assemblies are also disclosed.

Inventors:

CORISIS DAVID J (US)
CHONG CHIN HUI (SG)
LEE CHOON KUAN (SG)

Application Number:

PCT/US2007/076286

Publication Date:

July 31, 2008

Filing Date:

August 20, 2007

Export Citation:

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Assignee:

MICRON TECHNOLOGY INC (US)
CORISIS DAVID J (US)
CHONG CHIN HUI (SG)
LEE CHOON KUAN (SG)

International Classes:

H01L25/065

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