Title:
METAL CORE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/028098
Kind Code:
A1
Abstract:
Disclosed are a metal core printed circuit board for heat dissipation of electronic components, and a method for manufacturing the same. The metal core printed circuit board of the present invention comprises a top printed circuit board, a first insulating layer, a metal layer, a second insulating layer and a bottom printed circuit board. The top printed circuit board has a plurality of conductive patterns for mounting electronic components, and a plurality of thermal passages which extend from the back surface of each of the plurality of conductive patterns so as to be able to transmit heat of the electronic components. The first insulating layer, the metal layer, the second insulating layer and the bottom printed circuit board are stacked on the back surface of the top printed circuit board so as to be arranged between the plurality of thermal passages. The bottom printed circuit board has a plurality of conductive patterns, each of which is connected to each of the plurality of thermal passages. The manufacturing method of the present invention comprises: forming a first thermal passage and a second thermal passage of the top printed circuit board by means of multi-column photolithography; configuring the first insulating layer, the metal layer, the second insulating layer and the bottom printed circuit board in a stack structure; and forming a plurality of conductive patterns on each of the top printed circuit board and the bottom printed circuit board. The present invention allows heat of electronic components to be efficiently emitted through the metal layer and the thermal passages extending from the edges of the conductive patterns, thereby improving heat dissipation performance.
Inventors:
CHA SEUNG JIN (KR)
LEE YANG SOO (KR)
LEE YOUNG SOO (KR)
LEE YANG SOO (KR)
LEE YOUNG SOO (KR)
Application Number:
PCT/KR2015/008691
Publication Date:
February 25, 2016
Filing Date:
August 20, 2015
Export Citation:
Assignee:
ELITECH CO LTD (KR)
International Classes:
H05K3/40; H05K1/02; H05K1/18
Foreign References:
| JP2004104045A | 2004-04-02 | |||
| JPH1012982A | 1998-01-16 | |||
| KR19990044869A | 1999-06-25 | |||
| KR20090053622A | 2009-05-27 | |||
| KR20120053690A | 2012-05-29 |
Attorney, Agent or Firm:
DYNE PATENT & LAW FIRM (KR)
특허법인 다인 (KR)
특허법인 다인 (KR)
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