Title:
METAL DIE FOR MEASURING FLOW CHARACTERISTICS, METHOD FOR MEASURING FLOW CHARACTERISTICS, RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/064964
Kind Code:
A1
Abstract:
Disclosed is a metal die for measuring flow characteristics, which is to be used for the purpose of measuring the flow characteristics of a resin composition by applying the resin composition, i.e., a subject to be measured, to a channel provided in the metal die. The metal die for measuring flow characteristics is characterized in that the shortest distance from the cross-section gravity center to the outline of the cross-section shape of the channel is 0.02-0.4 mm. The method for measuring flow characteristics is characterized in that the resin composition, i.e., the subject to be measured, is applied to the channel of the metal die and the resin composition is made to flow in one direction, and the flow distance from the start point to the end point of the flow of the resin composition is obtained as a flow length.
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Inventors:
NISHIKAWA, Atsunori (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
Application Number:
JP2010/006733
Publication Date:
June 03, 2011
Filing Date:
November 17, 2010
Export Citation:
Assignee:
SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
International Classes:
G01N11/04; B29C45/27; B29C45/76
Attorney, Agent or Firm:
HAYAMI, Shinji (Gotanda TG Bldg. 9F, 9-2 Nishi-Gotanda 7-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
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