Title:
METAL DOT SUBSTRATE AND METHOD FOR MANUFACTURING METAL DOT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/097943
Kind Code:
A1
Abstract:
Provided is a metal dot substrate that is characterized in that, on a substrate, there are a plurality of metal-containing metal dots in an island shape, where the maximum outer diameter and height of the metal dots are both within the 0.1nm-1,000nm range. Further, provided is an electrical circuit substrate using the same. The metal dot substrate and the method for manufacturing the metal dot substrate allow for mass production at low cost, without requiring a complicated process and without limitation of the heat resistance of the substrate material.
Inventors:
NINOMIYA HIROKAZU (JP)
KAWABATA YUSUKE (JP)
ITO KIYOHIKO (JP)
KATAYAMA YUTAKA (JP)
KAWABATA YUSUKE (JP)
ITO KIYOHIKO (JP)
KATAYAMA YUTAKA (JP)
Application Number:
PCT/JP2013/083189
Publication Date:
June 26, 2014
Filing Date:
December 11, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C23C14/58; B82Y30/00; B82Y40/00; C23C14/14; G01N21/41
Foreign References:
| JP2007218900A | 2007-08-30 | |||
| JP2012030340A | 2012-02-16 | |||
| JP2010153612A | 2010-07-08 | |||
| JP2002223016A | 2002-08-09 | |||
| JPH08186245A | 1996-07-16 |
Attorney, Agent or Firm:
BAN Toshimitsu et al. (JP)
Toshimitsu Ban (JP)
Toshimitsu Ban (JP)
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