METAL ENCAPSULANT HAVING GOOD HEAT DISSIPATION PROPERTIES, METHOD OF MANUFACTURING SAME, AND FLEXIBLE ELECTRONIC DEVICE ENCAPSULATED IN SAID METAL ENCAPSULANT

Title:

METAL ENCAPSULANT HAVING GOOD HEAT DISSIPATION PROPERTIES, METHOD OF MANUFACTURING SAME, AND FLEXIBLE ELECTRONIC DEVICE ENCAPSULATED IN SAID METAL ENCAPSULANT

Document Type and Number:

WIPO Patent Application WO/2015/093903

Kind Code:

A8

Abstract:

The present invention relates to a metal encapsulant having good heat dissipation properties, a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant, and particularly, to a metal encapsulant having excellent flexibility, moisture resistance, workability, and heat dissipation properties by forming a coating layer including a metal-graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant.

Inventors:

PARK YOUNG-JUN (KR)
KIM KYOUNG-BO (KR)
KIM MOO-JIN (KR)
LEE SOO-CHERL (KR)
LEE JAE-RYUNG (KR)

Application Number:

PCT/KR2014/012606

Publication Date:

August 20, 2015

Filing Date:

December 19, 2014

Export Citation:

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Assignee:

POSCO (KR)

International Classes:

B32B15/08; H01L51/56

Attorney, Agent or Firm:

C&S PATENT AND LAW OFFICE (Daelim Acrotel13 Eonju-ro 30-gil,Gangnam-gu, Seoul 135-971, KR)

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