Title:
METAL EVAPORATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/199873
Kind Code:
A1
Abstract:
Provided is a metal evaporation material with which it is possible to prevent splashing without lowering the purity of the thin film. A metal evaporation material having a metal material in which a metal is the parent member and an additive metal, wherein the additive metal has: a metal low vapor pressure property such that, at a temperature of at least 700°C, the vapor pressure is less than 1/10,000th the vapor pressure of the parent material at the same temperature; and a reactivity such that the additive material reacts with gases released from a high-melting-point metal container to produce a reaction product. The reaction product has a product low vapor pressure property such that, at a temperature of at least 700°C, the vapor pressure is less than 1/10,000th the vapor pressure of the parent material at the same temperature. Bumping is prevented because the gas contained in the metal evaporation material reacts with the additive metal and is eliminated. The purity of the vapor-deposited thin film does not decline because additive-metal vapor and reaction-product vapor constitute less than 1/10,000th of the metal evaporation material vapor.
Inventors:
KURAUCHI TOSHIHARU (JP)
Application Number:
PCT/JP2017/018022
Publication Date:
November 23, 2017
Filing Date:
May 12, 2017
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
C23C14/24; C22C5/02
Foreign References:
| JPS61235556A | 1986-10-20 | |||
| JPS6250460A | 1987-03-05 | |||
| JP2011074442A | 2011-04-14 | |||
| JP2010210681A | 2010-09-24 |
Attorney, Agent or Firm:
ISHIJIMA Shigeo et al. (JP)
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