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Title:
METAL FILM, ELECTRONIC COMPONENT PROVIDED WITH METAL FILM AND METHOD FOR PRODUCING METAL FILM
Document Type and Number:
WIPO Patent Application WO/2019/131433
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide a metal film which is capable of preventing the formation of an intermetallic compound when a nickel-phosphorus film is brazed with an alloy, said intermetallic compound being formed of nickel in the nickel-phosphorus film and tin in the alloy. A metal film (1) comprises a nickel-phosphorus film (1a) in which crystalline Ni (12) is dispersed.

Inventors:
TAKEOKA SHINJI
ENAMI HIROYUKI
SHIRAISHI KENICHI
Application Number:
PCT/JP2018/046979
Publication Date:
July 04, 2019
Filing Date:
December 20, 2018
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C23C26/00; C22C19/03; C22F1/10; C23C18/16; C23C18/32; H01L35/08; C22F1/00; H01L21/52
Foreign References:
JP2007308802A2007-11-29
JPH0472075A1992-03-06
JP2011246739A2011-12-08
JP2008150226A2008-07-03
JPH09223312A1997-08-26
JPS60130801A1985-07-12
JPS5852832A1983-03-29
JP2001196646A2001-07-19
JPH1096084A1998-04-14
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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