METAL FILM FORMATION SYSTEM, METAL FILM FORMATION METHOD, AND COMPUTER STORAGE MEDIUM

WIPO Patent Application WO/2012/002124

A1

A liquid supply unit for supplying a metal complex and a solvent is connected to an application treatment unit. The liquid supply unit comprises a metal supply source in which the metal complex is to be stored, a solvent supply source in which the solvent is to be stored, a metal supply tube for connecting the metal supply source to an application nozzle in the application treatment unit, a solvent supply tube for connecting the solvent supply source to the application nozzle, a gas supply source in which an inert gas is to be stored, a first gas supply tube for connecting the gas supply source to the metal supply tube, and a second gas supply tube for connecting the gas supply source to the solvent supply tube. The inert gas is supplied from the liquid supply unit to the application nozzle prior the reduction of the pressure of the inside of the application treatment unit.

JP10251862	METHOD FOR COATING AL OR AL ALLOY TO METALLIC BASE BODY
WO/1995/004168	METHOD OF DEPOSITING THIN GROUP IIIA METAL FILMS
WO/2011/093515	METHOD FOR FORMING PATTERNED CONDUCTIVE FILM

KISHITA, Naofumi (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)

JP2011/063234

January 05, 2012

June 09, 2011

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TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku Tokyo, 25, 〒1076325, JP)
東京エレクトロン株式会社 (〒25 東京都港区赤坂五丁目３番１号 Tokyo, 〒1076325, JP)

C23C18/10; B05C9/12; B05C11/08; H01L21/288

KANEMOTO, Tetsuo et al. (Hazuki International, Kakubari Building 1-20, Sumiyoshi-cho, Shinjuku-k, Tokyo 65, 〒1620065, JP)

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