Title:
METAL FILM LAMINATE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/056145
Kind Code:
A1
Abstract:
The present invention addresses the problem of the inability to form a uniform metal film due to weak adhesion of a deposition metal film making it impossible to obtain a uniform adhesive force, or due to partial aggregation of metal nanoparticles resulting in a decrease in the adsorption force of some of the metal nanoparticles with respect to a primer layer, and provides a metal film laminate structure in which metal nanoparticles of a catalyst layer are surrounded by a primer layer of which one end is bonded to a plating deposition layer. The metal film laminate structure of the present invention has a cross sectional structure in which three layers, namely a primer layer, a catalyst layer, and a plating deposition layer, are laminated on a base material, characterized in that the primer layer is a resin layer with a glass transition temperature (Tg) of 40 to 430°C, and the catalyst layer comprises a group of metal nanoparticles arranged in a planar fashion on the primer layer, wherein the group of metal nanoparticles comprises a metal of group IB or group VIIIB in the periodic table, and wherein the metal nanoparticles are surrounded by the primer layer, of which one end is bonded to the plating deposition layer.
Inventors:
ITO MASAHIRO (JP)
Application Number:
PCT/JP2017/033131
Publication Date:
March 29, 2018
Filing Date:
September 13, 2017
Export Citation:
Assignee:
ELECTROPLATING ENGINEERS OF JAPAN LTD (JP)
International Classes:
C23C28/00; B32B15/01; B32B15/08; C23C18/42; C25D5/54; C25D7/00; H05K3/18
Domestic Patent References:
| WO2016098680A1 | 2016-06-23 | |||
| WO2016017625A1 | 2016-02-04 |
Attorney, Agent or Firm:
MIYAZAKI Satoru (JP)
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