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Patent Searching and Data


Title:
METAL FILM AND SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2020/116558
Kind Code:
A1
Abstract:
The present invention contains Cu in a range of 0.10-5.00 at. %, not more than 40 mass ppm of Pd, not more than 20 mass ppm of Pt, not more than 20 mass ppm of Au, and not more than 10 mass ppm of Rh, the total contained amount of Pd, Pt, Au, and Rh being not more than 50 mass ppm, and the remaining portion being Ag and unavoidable impurities.

Inventors:
TOSHIMORI YUTO (JP)
NONAKA SOHEI (JP)
KOMIYAMA SHOZO (JP)
HAYASHI YUJIRO (JP)
Application Number:
PCT/JP2019/047616
Publication Date:
June 11, 2020
Filing Date:
December 05, 2019
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/14; C22C5/06; C23C14/34; G02F1/1335; G02F1/1343; C22F1/00; C22F1/14
Domestic Patent References:
WO2016136590A12016-09-01
Foreign References:
JP2017088984A2017-05-25
JP2017031503A2017-02-09
JP2018228367A2018-12-05
JP2006028641A2006-02-02
JP6020750B12016-11-02
JP2017179594A2017-10-05
JP2017183274A2017-10-05
Other References:
See also references of EP 3892752A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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