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Patent Searching and Data


Title:
METAL-FOIL-CLAD SUBSTRATE, CIRCUIT BOARD, AND SUBSTRATE WITH HEAT-GENERATING BODY MOUNTED THEREON
Document Type and Number:
WIPO Patent Application WO/2016/063694
Kind Code:
A1
Abstract:
This metal-foil-clad substrate is used for forming a circuit board with a heat-generating body mounted thereon. This metal-foil-clad substrate comprises: a flat-plate-shaped metal foil; a resin layer formed on one surface of the metal foil; a heat-dissipating metal plate that dissipates heat generated by a heat-generating body, the heat-dissipating metal plate being formed so as to correspond, in a planar view of the resin layer, to a first region encompassing a region where the heat-generating body is mounted on the opposite surface of the resin layer from the metal foil; and an insulating part formed so as to correspond to at least a portion of a second region on the opposite surface of the resin layer from the metal foil excluding the first region. The insulating part is constituted by a cured product of a first resin composition including a first thermosetting resin. The resin layer is constituted by a cured product or a solidified product of a second resin composition that includes a resin material and that is different from the first resin composition. The heat-dissipating metal plate has a surface layer provided with a recess formed in a surface that is joined with the insulating part. The cured product of the first resin composition is embedded in at least a portion of the recess.

Inventors:
OKASAKA SHU (JP)
KOMIYATANI TOSHIO (JP)
KOIZUMI KOJI (JP)
TAKIHANA YOSHIHIRO (JP)
TAGO HIROAKI (JP)
Application Number:
PCT/JP2015/077734
Publication Date:
April 28, 2016
Filing Date:
September 30, 2015
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H05K1/02; B32B15/08; B32B15/092; B32B15/098; H01L23/12; H01L23/36; H05K1/03
Foreign References:
JP2011210877A2011-10-20
JP2012099540A2012-05-24
JP2001237363A2001-08-31
JP2007201453A2007-08-09
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
Morning ratio One husband (JP)
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