Title:
METAL FOIL FOR ELECTROMAGNETIC SHIELDING, ELECTROMAGNETIC SHIELDING MEMBER, AND SHIELDED CABLE
Document Type and Number:
WIPO Patent Application WO/2015/002130
Kind Code:
A1
Abstract:
[Problem] To provide a metal foil for electromagnetic shielding which exhibits corrosion resistance superior to conventional Sn plating, an electromagnetic shielding member, and a shielded cable. [Solution] A metal foil for electromagnetic shielding that has, formed on one or both surfaces of a substrate comprising a metal foil (1) having a thickness exceeding 4μm, an alloy layer (2) which comprises an A element comprising Sn or In, and a B element group of at least one selected from the group of Ag, Ni, Fe and Co. An underlayer (3) comprising the B element group is formed between the alloy layer and the substrate. The amount of the A element deposited is 10-300μmol/dm2, and the total amount of the B element group deposited is 40-900μmol/dm2.
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Inventors:
TANAKA KOICHIRO (JP)
Application Number:
PCT/JP2014/067333
Publication Date:
January 08, 2015
Filing Date:
June 30, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
H05K9/00; B32B15/08; C23C30/00; C25D5/10; C25D5/50; C25D7/06; H01B5/02; H01B5/14; H01B7/17
Domestic Patent References:
| WO2009144973A1 | 2009-12-03 |
Foreign References:
| JP2008274417A | 2008-11-13 | |||
| JP2002088496A | 2002-03-27 | |||
| JP2012199291A | 2012-10-18 | |||
| JP2008199051A | 2008-08-28 | |||
| JP2010236041A | 2010-10-21 | |||
| JP2003201597A | 2003-07-18 |
Other References:
See also references of EP 3007533A4
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
Ken-ichiro Akao (JP)
Ken-ichiro Akao (JP)
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